Welcome & aim of the review - CBM, MVD - CBM timeline, day-1

Design goal of MIMOSIS - requirements (table) - follow ups for design (pixel, digital) - occupany gradient, beam fluctuations & buffering

Design concept of MIMOSIS - technical details

Sensor periphery and data handling - MVD module - flex and FEE - electrical environment

MIMOSIS submission history - 0, CE18, 1, 2, 2.1 -> 3

MIMOSIS-1 and -2.1 test beam results - pixel types, EPI - rad. hardness

MIMOSIS-2.1 lab test observations - e.g. IKF report on observations

MIMOSIS-3 Desgin Reviews - highlights from the last report - follow up activities, simulations

MIMOSIS-3 Design Review consequences - lessons learned - mitigation strategy implemented

MIMOSIS-3 submission plans - choice of pixel, EPI - no. of wafers (& splits) - time line - flow of chips

Plans for wafer/chip QA - probe testing, yield assessment

Closed discussion (reviewers)

Open discussion (all) - remaining questions/answers - plan for documentation, minutes - a.o.b.

Close-out